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Delphi Technologies Inc.
Technology Inventory Search
Showing 1 - 10 of 26 matches for
Delphi Accelerometer Sensors
The Delphi Accelerometer Sensors all-silicon MEMS linear accelerometer works by measuring the current output from piezoresistive beams attached to a proof mass. Designed for automotive crash detection, they operate in the 50-1000 g range.
Classification:Electronics & MEMS: Micro Electronic Mechanical Systems (MEMS)
Delphi Battery Management
Delphi Battery Management provides electronic control for maintaining performance and life of energy storage devices (e.g., batteries, ultracapacitors).
Classification:Electronics & MEMS: Power Supply and Energy Storage
Delphi Compact Low Cost Rotary Knob
The Delphi Compact Low Cost Rotary Knob technology places the graphic indicators within the circumference of the knob's outside edge which allows a larger diameter knob to be used within the same amount of space for identifying control graphics. Use of a single material to manufacture the knob eliminates the need for additional materials, processes, and/or assembly. Ergonomic improvements are achieved after increasing the torque advantage provided by having a larger diameter. This technology also uses less energy for back lighting, if nighttime viewing is essential.
Classification:Electronics & MEMS: Switch Products
Delphi Conductive Adhesives
Delphi Conductive Adhesives use an electrically conductive epoxy adhesive as a replacement for lead-based solder for use in electronic packaging applications such as bonding circuit components to a substrate.
Classification:Electronics & MEMS: Miscellaneous
Delphi DC-DC Converter
The Delphi DC-DC Converter technology uses resonant topologies for converting electrical power from one (DC) voltage level to another (DC) level. It was developed for use in dual voltage (14v/42v) automotive electrical systems to meet requirements for converters not currently available on the market.
Classification:Electronics & MEMS: Electrical Connections
Delphi Dock & Lock Self-aligning Connection System
The Delphi Dock & Lock Self-aligning Connection System allows for self-aligning and blind-mate electrical connections when two mechanical housings are fit together. A simple design allows for larger pins, higher capacity, and higher design tolerances than traditional connectors. Current applications operate at voltages of 0.5-16 V DC and currents of 0.5-7.5 A. Misalignment is limited to +3.0 mm side to side and up and down with +2.5 fore/aft. Engaging forces average 1.25 N per contact. Variations in design and specifications are possible.
Classification:Electronics & MEMS: Electrical Connections
Delphi Efficient AC to DC Power Conversion Technology
Delphi's Efficient AC to DC Power Conversion Technology minimizes switching losses to create a near unity power factor to the AC power source and efficiently provides high quality DC power to the load. Switching losses are minimized through the use of resonant switching, which produces much less electromagnetic interference than hard-switched circuits and allows efficient operation of the conversion circuits at frequencies as high as 200kHz. High operating frequency can result in size, weight, and cost reductions.
Classification:Electronics & MEMS: Switch Products
Delphi Electrical Connector Position Assurance (CPA) Device
The Delphi Electrical Connector Position Assurance (CPA) Device eliminates the need for externally operated devices requiring separate connections that occupy the limited space beneath the instrument panel. With no detached components, the self-contained connection device helps reduce some assembly and service requirements.
Classification:Electronics & MEMS: Electrical Connections
Delphi Electronic Packaging—General
Delphi Electronic Packaging—General includes materials, substrates, assembly, and system packaging for electronics and electronic components.
Classification:Electronics & MEMS: Miscellaneous
Delphi Electronic Packaging—Overmold
Delphi Electronic Packaging—Overmold is a low cost electronic packaging technology whereby an entire circuitboard is overmolded with a special hard thermoset material providing a rugged and hermetically sealed environment for the board. The overmold can be applied as an underfill in flip chip applications and can encapsulate a heatsink and connectors. The overmold can be thermally sprayed with a metal to provide EMI shielding.
Classification:Electronics & MEMS: Miscellaneous
