Delphi

Delphi Technologies Inc.

Software and Databases for Licensing

Patents For Sale
Delphi has a variety of patent clusters for sale including:
  • Audio System Technologies
  • Display
  • Electronic Cooling
  • Flexible Printed Circuits
  • Nano-Epoxy Underfill
  • Navigation - GPS
  • Power Semiconductors
  • SDARS Satellite Broadcast Digital Receivers
  • Wireless Data Services Including RDS

For more information, contact Nasser Lukmani at Nasser.Lukmani
@delphi.com
.

Download the Delphi Patent Sales Agreement.

Learn More about DTI

Delphi 3-D Packaging Optimization Software

Delphi's 3-D Packaging Optimization Software program is a simulation that determines optimum, efficient packaging configurations for any part or assembly in its appropriate shipping container. Based on a 360, multi-axis algorithm related to the actual part geometry, the software takes a math-based design of the component and offers the user three different process options to systematically render packaging designs.

  • Manual mode allows a packaging engineer or designer to work with the software and arrive quickly at a space and cost saving arrangement
  • Automatic mode enables the computer to examine all possible configurations and offer the best possible options
  • Retrieve mode gives the ability to look up and reapply various optimized configurations

Benefits

  • Optimizes packaging efficiency in relation to cost, volume, part orientation, weight and design of the dunnage material
  • "Nesting" technique minimizes volume and increases packaging density while adhering to user specifications, including:
    • Weight
    • Volume flow
    • Spacing requirements
  • Dramatically reduces labor-intensive hours required to produce efficient packaging designs
  • Offers the ability and flexibility to customize container options to match a specific customer's existing portfolio
  • Minimizes shipping and packaging costs
  • Operates with commercially available CAD/CAM software
  • Quickly creates, manipulates and selects the best alternatives from among thousands of internal and external figurations 
  • Packaging can be designed, simulated and altered much earlier in the process 
  • Data can be shared with the extended supply chain to analyze impact of part designs
  • Can account for ergonomic and lean manufacturing requirements

Typical Applications

Delphi 3-D Packaging Optimization Software can be used in the container/dunnage design industry to optimize products and significantly lower material engineering and labor. It can also be used in the education industry to enhance the skills of packaging engineering students.

Uniform layer configuration

Staggered layer configuration 

Patent Number

7,366,643, System, method, and storage medium for determining a packaging design for a container

Classification

Software & Databases: CAE, CAD, and CAM

Inventor Names

Philip Verdura, Jayson D. Pankin, William F. Eckenwiler, Andrzej M. Pawlak, Tammy L. Neil, Kenneth E. Johnson

Contact Information

Tim Forbes
[1] 248.813.8065
timothy.forbes@delphi.com

 
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